导热硅脂
Thermal Putty

Bornsun's BN-PN series (thermal putty) are mud-like thermal materials whose form is between thermal pad and thermal grease.
Thermal putty could be shaped into required thickness and size by hand or mold. It could be still soft and deformable after using. BN-PN series thermal putty will not get cured which meets your demands of reapplying and repair of components.
In conjunction with outstanding compression characteristics (up to 80%), thermal Putty BN-PN series has a high thermal conductivity that results in very low thermal resistance. It’s naturally adhesive and requires no further adhesive coating which allows it to be applied at various complicated circumstances.
Thermal putty is electrically insulating and is stable from -60°C to 200°C.

 

ROHS Compliant: Yes 
 

Features
   Thermal conductivity: 1.0-7.0 W/m·K
   Excellent thermal performance
   Low thermal resistance
   Non-toxic, non-corrosive
   Electrically insulating
   Excellent deformability

 

Application
   LED
   Uneven surface components
   Between semiconductor and heat sinks
   Electronics

 

Packaging Description
   BN-PN series(thermal putty)  is available in:
   Cans (1Kg,2Kg)
   Buckets (10Kg,20Kg)


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